KEYNOTE LECTURES

The following leading experts in this field will be giving keynote lectures on their current research topics.

Monday, December 12
10:40-11:20
The Story Behind the Red Phosphorus Mold Compound Device Failures
Prof. Michael Pecht, University of Maryland, USA

11:20-12:00
Semiconductor Integrated Circuit Packaging Technology Challenges - Next Five Years
Dr. Mario A. Bolanos, Texas Instruments Inc., USA

Tuesday, December 13
10:00-10:40
Gbps Signal Transmission on Si CMOS ULSI
Prof. Kazuya Masu, Tokyo Institute of Technology

10:40-11:20
A Study of Hygro-Thermal Deformations and Stresses in FCPBGA
Prof. Sung Yi, Portland State University, USA

Submission of Abstract: June 30, 2005
Notification of Acceptance: July 31, 2005
Submission of Manuscript: September 30, 2005